Protocol Citation: rkdunwoo , clgordy 2023. Soil Plating Protocol. protocols.io https://dx.doi.org/ License: This is an open access protocol distributed under the terms of the Creative Commons Attribution License, which permits unrestricted use, distribution, and reproduction in any medium, provided the original author and source are credited Protocol status: WorkingWe use this protocol and it's working
Created: July 10, 2023
Last Modified: July 11, 2023
Protocol Integer ID: 84790
Keywords: soil plating protocol protocol for serial dilution, soil plating protocol protocol, soil sample, serial dilution, soil, sample